Dispersion copper
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Dispersion copper
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Product Description
Product Introduction
Compared with oxygen-free copper materials, the hardness of dispersed copper is higher (HV>125) and the strength is higher (tensile strength> 350MPa), while the corresponding data of oxygen-free copper are HV 40,250MPa. And has a higher softening temperature.
Product characteristics
|
Brand |
Melting Point |
softening temperature |
Density g/cm3 |
Coefficient of thermal expansion (10-6/K) |
Thermal conductivity W/(M.K) |
|---|---|---|---|---|---|
|
C15715 |
1083 ℃ |
800 ℃ |
8.84 |
365 |
17.6 |
|
C1560 |
1083 ℃ |
910 ℃ |
8.81 |
322 |
17.6 |
|
Comparison of the composition and physical properties of various types of dispersed and oxygen-free copper (at room temperature, unless otherwise specified). |
|||||||
|
UNS Alloy Quantity |
Alumina content |
Melting Point |
Density g/cm3 |
conductivity |
Thermal conductivity W/(M.K) |
Coefficient of thermal expansion |
modulus of elasticity |
|
OFC |
0 % |
1,083 ℃ |
8.94 |
58 Meg S/m |
391 wat/m/OK |
17.7 μm/m/Me |
115GPa |
|
UNS- |
0.3 wt. % |
1,083 ℃ |
8.90 |
54 Meg S/m |
365 what/m/OK |
16.6μm/m/℃ |
130GPa |
|
UNS- |
1.1 wt. % |
1,083 ℃ |
8.81 |
45Meg S/m |
322 what/m/OK |
16.6μm/m/℃ |
130GPa |
If it is necessary to reduce the thermal expansion rate, other materials or elements can be added. When added at high room temperature and high intensity heating, its hardness will also be enhanced.
Adding Glid AL-60 and 10% niobium to the composite can improve the strength and conductivity of the material. Its hardness is comparable to most copper-beryllium and copper-tungsten alloys, while its conductivity is comparable to all RWMA2 grades.
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