Copper Molybdenum Copper / Copper (CPC)
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Copper Molybdenum Copper / Copper (CPC)
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Product Description
Product Introduction
This material is a composite material with a sandwich-like structure, the core material is molybdenum-copper, and both sides are covered with copper.
Its coefficient of expansion and thermal conductivity are designable for low-expansion layers and heat conduction paths of heat sinks, lead frames, multi-layer printed circuit boards (PCBs), etc.
Product characteristics
|
Brand |
Density g/cm3 |
Coefficient of thermal expansion (10-6/K) |
Thermal conductivity W/(M.K) |
||
|---|---|---|---|---|---|
|
Plate direction |
Thickness direction |
Plate direction |
Thickness direction |
||
|
1:4:1 |
9.4 |
7.2 |
9.0 |
340 |
300 |
Product use
Its expansion coefficient and thermal conductivity are designable for RF, microwave and semiconductor high-power devices.
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