Copper Molybdenum / Copper (CMC)
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Copper Molybdenum / Copper (CMC)
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Product Description
Product Introduction
This material is a composite material with a sandwich-like structure, with a molybdenum core and copper clad on both sides.
Its coefficient of expansion and thermal conductivity are designable for low-expansion layers and heat conduction paths of heat sinks, lead frames, multi-layer printed circuit boards (PCBs), etc.
Product characteristics
|
Brand |
Density g/cm3 |
Coefficient of thermal expansion (10-6/K) |
Thermal conductivity W/(M.K) |
|
|---|---|---|---|---|
|
Plate direction |
Thickness direction |
|||
|
13:74:13 |
9.88 |
5.6 |
200 |
170 |
|
1:4:1 |
9.75 |
6.0 |
220 |
180 |
|
1:3:1 |
9.66 |
6.8 |
244 |
190 |
|
1:2:1 |
9.54 |
7.8 |
260 |
210 |
|
1:1:1 |
9.32 |
8.8 |
305 |
250 |
Product use
The use of the product is similar to that of tungsten copper alloy.
Its expansion coefficient and thermal conductivity are designable for RF, microwave and semiconductor high-power devices.
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