Electronic Packaging and Heat Sink Materials
-Electronic packaging refers to the housing of integrated circuit chips, passive devices, and the final product or system of the manufacture and production of circuit cards. Packaging is an important protection for environmental factors such as moisture, pollution, harmful chemicals, radiation signals, power transmission, heat dissipation, and electromagnetic interference shielding.
-Heat dissipation in micropower electronics and circuits is an inevitable by-product. The heat sink helps dissipate the heat, transferring it to the surrounding air. The design of the heat sink shape also increases its area of contact with the surrounding cooling air.
-Tungsten copper alloy is one of the refractory metal heat dissipation materials. It is made by vacuum infiltration of molten copper in a porous tungsten skeleton. By adjusting the content of tungsten, materials such as ceramics (alumina, beryllium oxide), semiconductors (silicon), and metals (Kovar alloy) are designed to match the coefficient of thermal expansion (CTE).