Product Description

Product Introduction

Molybdenum and tungsten, is also a rare high melting point metal, melting point second only to tungsten and tantalum, its high melting point, vapor pressure is very low, extension performance is better than tungsten, easy pressure processing, can be processed into very thin foil and very fine wire.

The thermal expansion coefficient is small, well matched with Si,GaN, GaAs, Al2O3, glass, etc., and the most suitable material for semiconductor packaging and sealing.

 

Product characteristics

Density: 10.2 g/cm3

Melting point: 2620 ℃

Linear expansion coefficient: 4.9*10-6/K

Thermal conductivity: 138W/(M.K)

 

Product use

  Pure tungsten has become the preferred high-end high-quality material in modern electronics, semiconductor and photovoltaic industries due to its excellent performance.

Semiconductor substrates, wiring materials for large-scale integrated circuits; and other high-tech materials.

Related Products

Online message


If you have any suggestions or feedback to our company, please fill in the relevant information on this page and submit it. A staff member will contact you in time, or please call us directly.

Submit