Molybdenum-copper alloy
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Molybdenum-copper alloy
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Product Description
Product Introduction
The molybdenum-copper alloy used for electronic packaging (heat sink), similar to the tungsten-copper alloy, also has compositional adjustability and thus adjustable thermal conductivity and coefficient of thermal expansion.
Compared with tungsten copper alloy, molybdenum copper alloy has lower density, but larger thermal expansion coefficient.
Product characteristics
|
Brand |
Molybdenum content Wt% |
Copper content Wt% |
Density g/cm3 |
Thermal conductivity W/(M.K) |
Coefficient of thermal expansion (10-6/K) |
|---|---|---|---|---|---|
|
Mo85Cu15 |
85± 1 |
Balance |
10 |
160 - 180 |
6.8 |
|
Mo80Cu20 |
80 ± 1 |
Balance |
9.9 |
170 - 190 |
7.7 |
|
Mo70Cu30 |
70 ± 1 |
Balance |
9.8 |
180 - 200 |
9.1 |
|
Mo60Cu40 |
60 ± 1 |
Balance |
9.66 |
210 - 250 |
10.3 |
|
Mo50Cu50 |
50 ±0.2 |
Balance |
9.54 |
230 - 270 |
11.5 |
Product use
High-power devices such as microwave, laser, radio frequency, optical communication, high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.
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