Tungsten copper alloy
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Tungsten copper alloy
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Product Description
Product Introduction
Tungsten copper electronic packaging material has both the low expansion characteristics of tungsten and the high thermal conductivity characteristics of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material, thus bringing great convenience to the application of the material. Tungsten copper alloy has an adjustable thermal expansion coefficient, which is similar to stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, alumina (black, white), etc. can be well matched.
The performance of tungsten copper alloy of our company is at the leading level in China. As a typical P/M material, the porosity of our products is extremely low, and the specific surface measured by BET method is half of that of our domestic counterparts (100 samples of 5*5*52mm are selected for comparison). In this way, the product has good air tightness, and the helium mass spectrometer leak test "5*10-9Pa · m3/S can be completely passed.
The company's tungsten copper alloy products do not add any activation sintering elements such as iron, nickel, cobalt, manganese. It has good thermal conductivity and thermal expansion matching performance. Tungsten copper alloy for electronic packaging (heat sink) can be customized according to customer requirements: WxCuy,x y = 100
Product characteristics
|
Brand |
Tungsten content Wt% |
Copper content Wt% |
Density g/cm3 |
Thermal conductivity W/(M.K) |
Coefficient of thermal expansion (10-6/K) |
|---|---|---|---|---|---|
|
W90Cu10 |
90 ± 1 |
Allowance |
17.0 |
180 - 190 |
6.5 |
|
W85Cu15 |
85 ± 1 |
Allowance |
16.4 |
190 - 200 |
7.0 |
|
W80Cu20 |
80 ± 1 |
Allowance |
15.6 |
200 - 210 |
8.3 |
|
W75Cu25 |
75 ± 1 |
Allowance |
14.9 |
220 - 230 |
9.0 |
|
W50Cu50 |
50 ± 1 |
Allowance |
12.2 |
310 - 340 |
12.5 |
Product use
High-power devices such as microwave, laser, radio frequency, optical communication, high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.
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