Pure tungsten
Key words:
Pure tungsten
Hotline:
Product Description
Product Introduction
Tungsten has the highest melting point and the lowest vapor pressure of all metals, making it an ideal material for ultra-high temperature, high vacuum technology and related industries.
Small thermal expansion coefficient, good matching with Si, GaN, GaAs, Al2O3, glass, etc., high melting point and high temperature stability, tungsten is the most suitable material for semiconductor package sealing.
The specific resistance of tungsten is lower than that of other heating materials, but it will increase with the increase of temperature. This resistance characteristic is particularly important for its application in high temperature furnace structures.
Because of their high density, tungsten and tungsten alloys have a high absorption capacity for radiation. The absorbing material for X-rays and γ-rays is a high tungsten content tungsten alloy with nickel-iron or nickel-copper as a binding phase, and the alloy is easy to process.
Product characteristics
Density: 19.3 g/cm3
Melting point: 3410 ℃
Linear expansion coefficient: 4.67*10-6/K
Thermal conductivity: 167W/(M.K)
Product use
Semiconductor substrates, tube grids, anodes, passive cooling device heat sinks, capacitor sinter boats and cups, x-ray targets and their fasteners, fixed anodes, detector components, collimators, shields, containers and accessories.
Previous Page
Next Page
Previous Page
Next Page
Related Products
Online message
If you have any suggestions or feedback to our company, please fill in the relevant information on this page and submit it. A staff member will contact you in time, or please call us directly.